Monday, March 12, 2012

HP eyes 2015 release for 3D integrated photonic chips

HP eyes 2015 release for 3D integrated photonic chips

It's unavoidable — mention HP and images of the TouchPad come floating to the surface. What most geek folk don't realize, however, is that the company recently famous for open sourcing webOS has been hard at work behind-the-scenes prepping for the next stage in computing: integrated photonics. The project, codenamed Corona, aims to create stackable 3D chips that communicate using inbuilt, microscopic lasers made from gallium.

2DayBlog.com

See also:
itnews, HP eyes 2015 release for 3D integrated photonic chips